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electronic packaging
1. The technical process of assembling electronic equipment, in which components are inserted above specific holes on multilayered circuit boards and then soldered to the printed wiring, which is often on the opposite side of the board.
2. The technology of packaging electronic equipment.

In current usage, it refers to inserting discrete components, integrated circuits, and MSI and LSI chips (usually attached to a lead frame by beam leads) into plates through holes on multilayer circuit boards (also called cards), where they are soldered in place.

3. The technology relating to the establishment of electrical interconnections and appropriate housing for electrical circuitry.

Electronic packages provide four major functions:

  • Interconnection of electrical signals.
  • Mechanical protection of circuits.
  • Distribution of electrical energy (that is, power) for circuit function.
  • Dissipation of heat generated by circuit function.
This entry is located in the following units: electro-, electr-, electri- (page 67) -tron, -tronic, -tronics + (page 11)